Products

Optical measurement systems engineered for precision manufacturing and quality control

LSI-TG

Tunable Laser Thickness Measurement System

Non-contact, non-destructive thickness measurement system utilising tunable laser technology. Capable of measuring objects from distances exceeding 1 metre, making it ideal for integration into production lines.

Key Features

Non-contact and non-destructive measurement
Measurement from distances >1m
Optimised for production line integration
Measurement of layers up to several mm (optical thickness)
High-speed measurement: thousands of measurements per second
Compatible with highly-doped Si wafer samples

Applications

Silicon wafer production controlPolishing and coating process controlHighly-doped sample measurementThick sample measurement
Technical specifications

WSI-TG

White Light Source Thickness Measurement System

Point spectroscopy thickness measurement system using white light source and spectrometer. Compact design suited for short-distance measurements, benchtop instruments, and portable applications.

Key Features

Compact design
Optimised for short-distance measurement
Suitable for equipment integration and benchtop use
Broad wavelength range enables thin film measurement
Non-contact and non-destructive
Real-time measurement capability

Applications

Thin film measurementBenchtop measurementPortable measurementProduction line integration
Technical specifications

FALCO

Hyperspectral Camera Thickness Measurement System

Optical measurement system for full-surface imaging and in-plane thickness distribution measurement. Proven track record in SOI silicon wafer outgoing inspection and pre-dicing inspection of patterned wafers.

Key Features

In-plane distribution measurement
High-speed measurement
Thickness distribution in 1.0×1.0mm or 5.0×5.0mm mesh
Non-contact and non-destructive
Optimised for SOI wafer inspection
Compatible with hoop loaders and transfer robots

Applications

SOI silicon wafer outgoing inspectionPre-dicing inspection of patterned wafersThickness in-plane distribution measurementLarge-scale inspection systems
Technical specifications

LSU-C01S04

Light Source Unit

Compact light source unit with high-performance LED and integrated control board in a palm-sized housing. First packaged product developed from over 30 years of spectroscopic analysis experience.

Key Features

Compact housing
High-performance LED
Low heat generation design
Stable light output
Integrated control board
Easy integration

Applications

Light source for spectroscopic measurementIntegration into inspection equipmentResearch and development applicationsEducational applications
Technical specifications

Demonstration & Evaluation

We accommodate demonstration requests to the extent possible. The WSI-TG-based measurement system is available for loan due to its relatively compact size. For the larger LSI-TG and FALCO systems, measurements can be conducted with samples brought to our facility or loaned to us.

Request Demonstration